深圳市卓创兴电路有限公司是一家致力于高精密单双面和多层印制电路板、以及金属基板生产的高新技术企业，公司全体员工300余人，拥有现代化的专业生产设备和检测设备，严格按照现代化企业制度管理规范运作，组建了一批专业从事PCB的生产制造团队，卓越的品质来自卓越的管理团队，能为您提供优质快速及个性化的OEM/ODM增值服务。
公司生产的高精密电路板广泛用于PC、通信、工控、消费电子、航空航天、生物医疗等高科技领域。公司产品质量参照IPC标准，并通过ISO9001品质保证体系，UL安全认证等认证，产品远销全国各地以及欧美、日本、东南亚等国家和地区。
作为一家有抱负和强烈社会责任感的企业，公司秉承“致力于成为PCB行业中最优秀增值服务商”的经营理念，并以此理念，我们曾诺持续改善、追求卓越、为共同实现客户您的产品构想而不懈努力！
Surface treatment：ENIG
Number of layers：4
Board Thickness：0.9mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.12/0.12mm
Particularity：Rogers 4835 + FR4
Application：automotive radar
Surface treatment：ENIG
Number of layers：6
Board Thickness：1.15mm
Min. Hole Size：0.25mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：mechanically drilled blind hole, Rogers 4350 + FR4
Application：ADAS
Surface treatment：ENIG
Number of layers：12
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：Particularity: resin plug hole, depth control drill
Application：power supply
Surface treatment：ENIG
Number of layers：Number of layers: 3
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：copper-inlay
Application：communication
Surface treatment：ENIG
Number of layers：2L
Board Thickness：0.5mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0. 2/0. 2mm
Particularity：through-hole filling; aspect ratio 1: 1
Application：LED
Surface treatment：ENIG
Number of layers：6L
Board Thickness：0.8mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0. 15/0.15mm
Particularity：long and short gold finger + step routing slot
Application：industrial control
Surface treatment：ENIG
Number of layers：4
Board Thickness：1.2mm
Min. Hole Size：0.075mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：2-order HDI, blind hole, buried hole
Application：communication
Surface treatment：ENIG
Number of layers：8L
Board Thickness：1.3mm
Min. Hole Size： 0.1mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：1st order HDI, blind hole, buried hole, rigid-flex
Application：automotive electronics
Surface treatment：ENIG
Number of layers： 4L
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：semi-flex
Application：communication
Surface treatment：electrogilding
Layer count：2L
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：industrial control
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：medical
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.10±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: 10%
Application：UAV
Surface treatment：Surface treatment: immersion gold
Layer count：4
Maximum finished board thickness：0.2mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.1mm
Feature：Impedance accuracy ±10%
Application：Application: smartphone (camera)
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12 ± 0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：laser spot welding
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.11±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.085/0.09mm
Feature：
Application：smartphone
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.055/0.06mm
Feature：
Application：liquid crystal display module
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.04/0.08mm
Feature：
Application：liquid crystal display module
更多产品
Surface treatment：ENIG
Number of layers： 6L
Board Thickness： 0.79mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0.15/0.15mm
Particularity： long and short gold finger + step routing slot
Application：industrial control
Surface treatment：ENIG
Number of layers：4L
Board Thickness：0.6mm
Min. Hole Size：0.12/0.12mm
Min. trace width/trace space: 0. 3mm
Particularity：
Application： industrial control
Surface treatment： ENIG
Number of layers：12L
Board Thickness：1.02mm
Min. Hole Size：0.2mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：Fine lines, micro-vias
Application：industrial control
Surface treatment： immersion gold
Layer count： 2
Maximum finished board thickness：0.13±0.03mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：smartphone
Surface treatment：immersion gold
Layer count：3
Maximum finished board thickness：0.2±0.05mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.15/0.078mm
Feature：
Application：smartphone
Surface treatment： immersion gold
Layer count：4
Maximum finished board thickness：0.25±/-0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: ±10%
Application：smartphone
Surface treatment： immersion gold
Layer count：3
Maximum finished board thickness：0.23±0.05mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.10/0.15mm
Feature：impedance accuracy ±10%
Application：smartphone
Surface treatment：ENIG
Layer count：6L
Maximum finished board thickness：0.5±0.02mm/-0.05 mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.06mm
Feature：
Application：smartphone
| Layer Count: | 1-32 Layers |
| Min Line width/Line space: | 3 mil/3 mil |
| Min mechanical drilling hole size | Board thickness≦ 1.2mm 0.15mm |
| Board thickness≦ 2.5mm 0.2mm | |
| Board thickness>2.5mm Aspectratio≦ 15:1 | |
| Aspect ratio | 15:1 |
| Finished Board Thickness | Max 10mm |
| Min 2L: 0.2mm; 4L: 0.35mm; 6L: 0.55mm; 8L: 0.8mm; 10L: 1.0mm | |
| Finished copper thickness(inner layer/out layer) | 6oz/10oz |
| Max panel size | 450x1800mm (18"x71") |
| PTH wall thickness | 0.025mm |
| PTH hole dia. tolerance | ±0.075mm |
| Non PTH hole dia. tolerance | ±0.05mm |
| Hole position deviation | ±0.05mm |
| Outline tolerance | ±0.10mm |
| Min S/M Pitch | 0.075mm |
| Twist and Bow | ≤1.0% |
| Test Voltage | 50~300v |
| Electric strength | ＞1.3KV/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldermask abrasion | ＞6H |
| Thermal stress | 288℃ 20Sec |
| Flammability | 94V-0 |
| Impedance Control | +/-5%(Differential) |
| Blind/Buried via | yes |
| Surface Finished | ENIG, ImAg ,ImSn, OSP, Leaded HAL, Lead free HAL(SN100C), Flash Gold,Hard Gold |
| Impedance Tolerance | ± 10% |
| Min dielectric thickness | 2mil |
| Type of dielectric material | FR4, High TG, Halogen Free material, Aluminum basedmatcrial,Copper based material,High frequency material, PTFE material, Heavy copper foil,Paperphenolic plate, BT, PI, Composite material, PTFE+metal based. |
| Major Material supplier | Shengyi 、 ITEQ、 Isola、Ventec、 KB、Rogers、Taconic、Nelco、Bergquist。 |
特色技术 ‐ 盲孔和埋孔，焊盘，硬金和金手指，闪金，镍/钯/金表面处理，边缘电镀，卡式孔，压入孔，深度控制布线，埋头孔。
◆ 完全符合ISO 质量管理体系，通过了ISO9001:2008, ISO14001:2004, ISO/TS16949:2009美国和加拿大UL认证
◆ AOI、孔铜测试、可焊性测试、XRF测试、阻抗控制/测试、金相测试分析
◆ 100% 测试和检验，产品符合IPC-A-600-H和IPC-6012标准
◆ 出货前二次检验
我们随时为您服务
联系人：刘先生13692188798
Q Q：1078645795
个人邮箱：tc88pcb@126.com
公司网址：http://www.zcxpcb.com
市场部邮箱：pcbzcx@126.com
地址：深圳市宝安区福永街道白石厦东区新开发区12栋
联系人：17362398668 张先生（微信同号）
公司网址：http://www.zcxpcb.com
市场部邮箱：pcbzcx@126.com
地址：深圳市宝安区福永街道白石厦东区新开发区12栋
